IEC 61000-4-3: How Radiated Immunity Testing Works
The setup, levels and chamber requirements of IEC 61000-4-3, the test that measures a device's immunity to radio transmitters and mobile phones.
The points where electronic products most often fail EMC certification, and simple measures you can take at the design stage, from an engineer's view.
The most common cause is noise from switching power supplies traveling onto the power cable and from there into the air. An inadequate input filter, or a filter placed in the wrong spot, causes the limit to be exceeded in the conducted emission test.
The second cause is cables. An unshielded USB, Ethernet or sensor cable, or one with a poorly terminated shield, radiates board noise like an antenna. Bonding the cable shield at the connector with full 360-degree contact largely solves this.
Long traces for fast clock signals, the lack of a continuous ground plane and a split return-current path are the main sources of radiated emissions. These are the hardest problems to fix once the board has been made.
Using an unbroken ground plane on multilayer boards, keeping clock traces short and not splitting the return path under fast signals prevents most of the problems you'd face in testing.
In metal enclosures, ventilation holes, display windows and seams can form unwanted slot antennas. In plastic enclosures, every point the user can touch is a risk in ESD testing.
Conductive gaskets on enclosure seams, many small holes for ventilation and a short ground path around connectors reduce these problems. For ESD details, see our article on IEC 61000-4-2.
None of these problems is mysterious; the real issue is that they are found late. A problem that surfaces when the product first goes to the certification lab means a board revision, a new prototype and a retest.
Regular measurements during design in an in-house pre-test chamber break this cycle. Problems are solved in days instead of weeks, and the product arrives at the lab ready.
It depends where the problem lies. A cable or filter change can be solved in days; if a board revision is needed, it can stretch to weeks.
Not identical, but a well set-up pre-test arrangement reliably shows problem frequencies and trends.
Sometimes it's enough, but it adds cost and assembly effort. The permanent fix usually lies in the board or cable design.
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